Is there a new insulating base film to replace the polyimide film?

As the performance requirements of flexible circuit boards are getting higher and higher, how to correctly select the material of its flexible substrate - FCCL's high-performance raw materials is very important to ensure that the product can still maintain the original electrical, heat-resistant and mechanical properties in subsequent processing in the process.

So far, among the types of film substrates used in FPC, although there are polyester resin, epoxy resin, polyester epoxy resin, polyetherimide (PEI), polytetrafluoroethylene resin (PTFE), polyetherketone ether (PEEK), liquid crystal polymer (LCD) and rolled Rf -4 copper clad foil (thickness 50mm) have been used below μm, examples of film substrates include Sumitomo Bakelite, Panasonic, Kyocera Chemical, Lichang Industry, etc., But the vast majority still use polyimide resin.

At present, there is no ideal new insulating base film to replace polyimide film. The reason is that the polyimide resin film has better heat resistance, rigidity, flexibility and electrical properties than other resin films. But its disadvantage is that the price of the film of the high heat-resistant rigid copper clad laminate is higher than the price of the resin substrate (or other films).

In summary, 6052 polyimide film is still one of the most important film materials for manufacturing flexible copper clad laminates. Its content in the insulating base film used in FCCL accounts for more than 85% of the total. Like the role of the rigid CCL insulating substrate material, the main role of the flexible insulating base film is to provide mechanical support and high dielectric insulation for electronic circuits. The use of flexible insulating substrate films instead of rigid insulating substrates is the main feature of flexible circuit boards, which is also the fundamental difference between flexible circuit boards and rigid circuit boards.

It is based on polyimide film and coated with special pressure-sensitive adhesive. It has good chemical resistance and abrasion resistance. It can withstand temperatures up to 320°C. It has a certain anti-corrosion effect on chemical substances such as flux, flux, and cleaning agent. It can maintain excellent performance in extremely harsh high temperature and wear environments. Specifically designed for character or barcode labels on printed circuit boards as it can withstand the attack of flux and flux during printed circuit board production. At present, the thickness is mainly 25um and 50um, and the commonly used colors are black and white.